The Shift to 3D-IC: A New Era For Backend Design Engineers
The Shift to 3D-IC: A New Era For Backend Design Engineers The semiconductor industry’s shift from traditional 2D scaling to three-dimensional integrated circuits (3D-ICs) is transforming chip design. By stacking silicon layers vertically, 3D-ICs deliver significantly higher device density, performance, and energy efficiency—all essential for advancing AI, high-speed computing, and mobile technologies. However, while […]